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This
tape is used for masking during the plating
and etching of all kinds of electrical parts.
It is also suitable for masking leadframes,
shadow masks and all kinds of electrical parts
during manufacturing. |
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Characteristics |
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It securely guards
the substrate from treatment solutions
during plating and etching. |
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There is a line
up of low adhesion type to strong adhesion
type to match your substrate's characteristics.
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Because of the
double-layer, co-extrusion production
method, even the strong adhesive type
rarely leaves any adhesive residue on
the substrate. |
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Uses |
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It masks leadframes, shadow-masks, and all
kinds of electrical parts during the manufacturing
process. |
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