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Sekisui Double-Faced Tape for Fixing Polishing Pads
   
 
Characteristics
Chemical Resistance
Because our tape uses a special adhesive that is unaffected by acid or alkaline polishing liquids, our tape never peels off during the polishing process.
Non-0Contamination
Our tape does not contain metals, which negatively impact silicon wafers.
Thickness Precision
Because its base material and its adhesive face are smooth and uniform, thickness is precise.
Easy Removal
It can be peeled off perfectly when the polishing pad is changed.
Can Offer Wider Products
Wide widths up to 1,650 mm are available. They can meet the needs of large caliber, silicon wafers.
Meeting Custonized Needs
We can design the best, double-faced tape to fit your polishing cloth and method.
   
 

  Uses    
 
 
It is for fixing the polishing pads for silicon wafers, hard disks, glass lenses, etc. in place.



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